Immerse the electronics, or run fluid through a cold plate on top of them. Both remove the air gap; both are supported end to end with our own coolant.
CPUs, boards, memory and drives are submerged in a dielectric, chemically inert coolant that circulates and carries heat away. Thermal resistance from component to environment drops by an order of magnitude against air.
Single-phase systems use Runhe's silicone-based coolant and hold component temperature constant without additional maintenance. PUE can reach below 1.06, and because the fluid touches every surface, the internal temperature field stays highly uniform — which lowers thermal runaway risk.
Two-phase systems use Runhe's proprietary fluorinated fluid and exploit latent heat of vaporisation. The boiling fluid absorbs large amounts of heat, giving a heat transfer coefficient far above single-phase convection — the right tool for ultra-high power density.
AI computing centers, HPC, edge computing and enterprise data centers. Particularly useful where floor space is limited, where a traditional machine room cannot be built, where delivery must be fast, or where environmental and safety rules are strict.
Cold plates sit on the CPUs and GPUs inside the server. Heat conducts into the coolant, and a CDU rejects it to a facility loop. The server architecture barely changes.
Minimal modification to existing server architectures and rack layouts.
A practical short-to-medium-term route for legacy IDC retrofits.
Better PUE and a more comfortable operating environment for the hall.
Superior cooling performance with tight chip-to-chip variance.
Medium-to-large data centers, AI computing centers, enterprise server rooms and IDC retrofits. It is the pragmatic choice when the estate already exists and downtime has to stay near zero.
Runhe is one of the few companies able to develop and mass-produce a full series of data center coolants: single-phase immersion, cold plate, and two-phase fluorinated fluids.
A dedicated CFD team simulates the whole machine and shapes inlet and outlet geometry for even flow across every node and a uniform tank temperature field.
Power, coolant temperature, ambient humidity and flow rate feed an adaptive thermal model that damps oscillation and removes local hot spots in real time.
On H800-class servers the current platform supports GPU power densities above 88 W/cm² at a PUE under 1.06.
Most estates end up hybrid: cold plate on the dense racks, immersion where the density or the room makes it worthwhile. We can model both against your load.
